New Product Introduction Engineer

onsemi

  • Bien Hoa, Dong Nai
  • Permanent
  • Full-time
  • 7 days ago
Job Category: EngineeringDegree Level: BachelorsJob Description:Job Summary:Introduces and maintains assembly processes and activities to ensure the requested requirements from manufacturing and quality are achieved. Cross-functional work with Central Engineering and other manufacturing teams to transfer, qualify and ramp-up of new product/package/technology.Responsibilities:Responsibilities
  • Report to NPI leader in coordination with R&D New Products Development group to develop strategy for new products.
  • Provide engineering support for all activities in product development process.
  • Responsible to new product/package/technology transfer, production setup and validation running in the factory and ramp up to production.
  • Drive integrations, cross-functional work with other manufacturing departments, and ramp-up of volume/yield/cost/stability and quality of new technologies into production.
  • Define risk assessment and risk mitigations plan, Bill of Material (BOM) selection, process flow.
  • Technical gap analysis, Design for Manufacturability, cost competitiveness in consideration.
  • Troubleshoot, investigate, root cause analysis into qualification failure and method issues.
  • Material and equipment and manufacturing peripheral selection to meet quality, reliability, cost, yield, and production targets.
  • Drive improvement project and work with unit process to improve stability, yield, cost and quality.
  • Successfully implement and Fan-out new product from an engineering build to manufacturability environment by using tools such as design factorial DOE, SIPOC and Lean Six Sigma.
Qualifications:Qualifications
  • BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent.
  • A minimum of 5 years or more experience in semiconductor packaging and manufacturing.
  • Experiences in assembly and test processes of wire bond, dicing, die attach, especially on Au, Cu, Al wire bonding.
Requirements
  • Proficiency in Engineering Tools such as AutoCAD, 8D, SPC, DFMEA, DOE.
  • Lead project across organization and culture in a fast-paced environment.
  • Teamwork and able to work independently.
  • Solder ball, Cu pillar, hybrid, thermocompression, and novel bonding techniques
  • Power module packaging, reliability, and chip package (CPI) experiences.
  • Semiconductor or silicon/silicon carbide wafer processing experience a plus.
  • Experience in data analysis using JMP, Minitab, Power BI…
About Us:onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.More details about our company benefits can be found here:About the Team:We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

onsemi